Description
Soft, thixotropic, solvent free, epoxy paste, formulated to cure at room temperature and produce a high strength structural adhesive for bonding of metals, particularly aluminium and steel. Formulated to overcome the problem of peeling failure in a metal-resin interface. High chemical resistance, high compressive & tensile strengths, and also has excellent adhesion to all normal substrates. Mix Ratio 1 part hardener to 1 part resin by weight or volume.
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